Etch of wafer pieces cut by DISCO Wafersaw in Lampoly
PROM Request Title:
Etch of wafer pieces cut by DISCO Wafersaw in Lampoly
PROM Date:
04/13/2017
PROM Decision:
Request approved.
Link to PROM Request and supporting documentation:
Equipment List:
Lam Research TCP 9400 Poly Etcher (lampoly)
PROM Request Summary:
Procedure to go from wafer saw to clean Lampoly etcher.