The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch (similar to Drytek 2) or Downstream plasma modes. There are 3 gases that are plumbed to the tool: Gas1: O2, Gas2: CF4, and Gas3: SF6. The characterized etches allowed in this tool include O2 descum, PhotoResist strip, Silicon-Nitride etch, isotropic silicon etch.
Cleanliness:
Flexible
Lab Facility:
SNF
Training Charges:
0.50 hours
Primary Trainer:
Lavendra Mandyam
Backup Trainer(s):
Cliff Knollenberg
Primary Maintenance:
Elmer Enriquez
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Samco Operating Instructions
- Samco Training Video
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Lavendra Mandyam
Location:
SNF Cleanroom Paul G Allen L107
Badger Area:
SNF: Dry Etching
Badger ID:
samco
Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
8 inch wafer
Other form factors
(O2)
(SF6)
(CF4)
Maximum Load:
Four 4" wafers or two 6" wafers and one 8" wafer
Silicon
Silicon Germanium
Quartz
Sapphire
Glass
Germanium
Silicon Carbide
Gallium Nitride
III-V
Gallium Arsenide
Polymer
Carbon Polymer Based
Lithium Niobate
Other (ProMCom approval required)
Primary Materials Etched:
()
Other Materials Etched:
PDMS
Polyimide
Polymer
Silicon Oxynitride
Silicon Nitride
Silicon Dioxide
Silicon