DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.
Links
[1] https://snfguide.stanford.edu/snf/cleanliness/flexible
[2] https://snfguide.stanford.edu/guide/lab-organization-facility/snf/snf-exfab
[3] https://snfguide.stanford.edu/guide/people/saeed-nejad
[4] https://snfguide.stanford.edu/guide/people/swaroop-kommera
[5] https://snfguide.stanford.edu/forwards-to-snf-was-how-to-join-snf
[6] https://snfguide.stanford.edu/guide/docs/operating-instructions/disco-backgrind-operating-procedure
[7] https://snfguide.stanford.edu/guide/locations/snf-exfab-paul-g-allen-159-capitola
[8] https://snfguide.stanford.edu/snf/badger-area/nsil-159-capitola