Wafer scribe and etch procedure to go into clean etch tools
PROM Request Title:
Wafer scribe and etch procedure to go into clean etch tools
PROM Date:
02/19/2019
PROM Decision:
Approved.
Link to PROM Request and supporting documentation:
Equipment List:
Epilog Fusion M2 Laser Cutter (lasercutter)
Lam Research TCP 9400 Poly Etcher (lampoly)
PROM Request Summary:
Introduce jig and create process flow to dice a wafer into pieces and be allowed into clean etch tools without addtional cleans.