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Tin

Chemical Formula: 
Sn

Equipment Tabs

Deposition Equipment
Partial words okay.
Deposition Equipment
Equipment name & Badger ID Cleanliness Locationsort descending Material Thickness Range Approved Materials supplied by Lab
Lesker2 Sputter
lesker2-sputter
SNF Cleanroom Paul G Allen L107
1.00 μm
Lesker Sputter
lesker-sputter
SNF Exfab Paul G Allen 155A Venice
Projects
Au-Sn Eutectic chip-bonding for high heat flux vapor chamber applications using Flip Chip Bonder: Suggestions and Tips -- (Nano Nugget)
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