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Silicon Germanium

Chemical Formula: 
SiGe
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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
Sensofar S-neox
s-neox
Sensofar S-neox Training All
SNF
SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Teos2
teos2
Teos Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Very conformal.

Thermco1
thermco1
Thermco Oxidation Furnaces Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

ThermcoLTO
thermcoLTO
Thermco LTO Deposition Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

limits on material vapor pressure

ThermcoPoly1
thermcopoly1
Thermco Poly Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.

Tylan9
tylan9
Forming Gas Anneal Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Any material that won't vaporize is okay. N2 and Ar annealing available.

TylanBPSG
tylanbpsg
TylanBPSG Deposition Furnace Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Wet Bench Clean 1
wbclean-1
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Wet Bench Clean 2
wbclean-2
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist as mask allowed

Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist will be removed

Wet Bench CMOS Metal (wbclean3)
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Wet Bench Decontamination
wbdecon
Wet Bench Decontamination Training Clean
SNF
SNF Cleanroom Paul G Allen L107

KOH or wafersaw or post-cmp decontamination

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Resist Developer Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Sensofar S-neox
s-neox
All
,
,
,
,
,
,
,
,
1
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Tencor P2 Profilometer
p2
Clean, Semiclean
,
,
,
,
,
,
,
,
1
Teos2
teos2
Pre-Diffusion Clean Clean
50 Å - 5 μm
450 °C - 680 °C
,
,
45
Thermco1
thermco1
Pre-Diffusion Clean Clean
25 Å - 2 μm
700 °C - 1100 °C
,
,
50
ThermcoLTO
thermcoLTO
Flexible
100 Å - 3 μm
300 °C - 450 °C
,
,
26
ThermcoPoly1
thermcopoly1
Pre-Diffusion Clean Clean
100 Å - 3 μm
525 °C - 650 °C
,
,
44
Tylan9
tylan9
Flexible
250 °C - 1100 °C
,
,
50
TylanBPSG
tylanbpsg
Pre-Diffusion Clean, Standard Metal Clean Clean, Semiclean
100 Å - 3 μm
300 °C - 450 °C
,
,
26
Wet Bench Clean 1
wbclean-1
Clean
,
,
25
Wet Bench Clean 2
wbclean-2
Clean
,
,
25
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Clean
,
,
Wet Bench Clean_res-hf
wbclean_res-hf
Clean
,
,
Wet Bench Clean_res-piranha
wbclean_res-piranha
Clean
,
,
Wet Bench CMOS Metal (wbclean3)
wbclean3
Semiclean
,
,
25 wafers
Wet Bench Decontamination
wbdecon
Clean
,
,

Pages