Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Resist | Developer | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
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Samco PC300 Plasma Etch System samco |
Flexible |
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||||||||
Savannah ALD savannah |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 250 °C
|
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SEM -Zeiss Merlin sem-merlin |
All |
0.00 mm -
35.00 mm
|
6 in wafer |
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Sensofar S-neox s-neox |
All |
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1 | ||||||||||||
SPTS uetch vapor etch uetch |
All |
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1 | ||||||||||||
SVG Develop Track 1 svgdev |
All |
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25 4 inch wafers | ||||||||||||
SVG Develop Track 2 svgdev2 |
All |
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25 4 inch wafers | ||||||||||||
SVG Resist Coat Track 1 svgcoat |
All |
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25 4 inch wafers | ||||||||||||
SVG Resist Coat Track 2 svgcoat2 |
All |
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25 4 inch wafers | ||||||||||||
Technics Asher technics |
Flexible |
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Four 4" wafers to pieces, one 6" or 8" wafer | ||||||||||||
Tencor P2 Profilometer p2 |
Clean, Semiclean |
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1 | ||||||||||||
Tylan9 Forming Gas Anneal Furnace tylan9 |
Flexible |
250 °C - 1100 °C
|
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50 | |||||||||||
Wet Bench Clean 1 wbclean-1 |
Clean |
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25 | ||||||||||||
Wet Bench Clean 2 wbclean-2 |
Clean |
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25 | ||||||||||||
Wet Bench Clean_res- hotphos wbclean_res-hotphos |
Clean |
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Wet Bench Clean_res-hf wbclean_res-hf |
Clean |
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Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | ||||||||||||
Wet Bench Decontamination wbdecon |
Clean |
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