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Quartz

Chemical Formula: 
SiO2
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Woollam
woollam
Woollam Training All
SNF
SNF Cleanroom Paul G Allen L107
Karl Suss MA-6 Contact Aligner 2
karlsuss2
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align.

Karl Suss MA-6 Contact Aligner 1
karlsuss
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align, including IR.

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lithography Solvent Bench
lithosolv
Lithography Solvent Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
Nanospec 210XP
nanospec2
Nanospec Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All
SNF
SNF Cleanroom Paul G Allen L107

3 Probe Heads for different Cleanliness

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Thermco1
thermco1
Thermco Oxidation Furnaces Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

Wet Bench Clean 1
wbclean-1
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Wet Bench Clean 2
wbclean-2
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist as mask allowed

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Innotec Evaporator
Innotec
Flexible
,
,
22 four inch wafers
Intlvac Evaporation
Intlvac_evap
Clean, Semiclean
0 - 1 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner 1
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner 2
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All
,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
All
100 μm - 1000 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
Lithography Solvent Bench
lithosolv
Flexible
,
,
,
,
,
,
,
,
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All
,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Nanospec 210XP
nanospec2
All
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
Prometrix Resistivity Mapping System
prometrix
All
,
,
,
,
,
,
,
,
1

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