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Equipment Moves & Changes

Tool New Normal Changes
AJA2 Evaporator (aja2-evap)

General New Normal Policies apply.

EVG Contact Aligner (evalign)

EV aligner was rotated 90 degrees and now shares a single operator station with the EVbonder.

EVG Wafer Bonder (evbond)

EV bonder and EV aligner now share a single operator station. EVbond computer terminal and prep area has been moved to the left side of the tool.

Flexus 2320 Stress Tester (stresstest)

New location! Still in the same room, cleanroom litho area. It has been moved closer to the ASML into the corner where the Singe oven used to be, opposite the YES oven.

Formlabs Form2 3D Printer (form2-3d-printer)

The Formlab has MOVED to Room 155. Please contact Michelle and Swaroop if you need access to the Formlab.

HMDS Vapor Prime Oven, YES (yes)

New program added: #05 Singe Bake 150C dehydration (vacuum) only, no HMDS. Replaces the oven bake 150C at the Singe oven which has been permanently removed from lab.

Lesker2 Sputter (lesker2-sputter)

General New Normal Policies apply.

Nanospec 210XP (nanospec2)

New location! Now in Stinson 104 Exfab, behind Heidelberg MLA150.

Nanospec 3 (nanospec3)

New location! Now on table opposite the wbclean in the white light area. It replaced the nanospec1.

Profilometer AlphaStep D-300 (alphastep2)

General New Normal Policies apply.

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Last modified: 6 Jun 2020