Wafer scribe and etch procedure to go into clean etch tools
PROM Request Title:
Wafer scribe and etch procedure to go into clean etch tools
PROM Request Summary:
Introduce jig and create process flow to dice a wafer into pieces and be allowed into clean etch tools without addtional cleans.
PROM Date:
02/19/2019
PROM Decision:
Approved.
Link to PROM Request and supporting documentation:
