Use of Copper Mask in SF6/O2 chemistry in PT-MTL
PROM Request Title:
Use of Copper Mask in SF6/O2 chemistry in PT-MTL
PROM Request Summary:
Request to use copper as a masking layer for etch in PT-MTL using SF6/O2 chemistry.
PROM Date:
06/10/2014
PROM Decision:
Rejected. Risks to both equipment and subsequent users deemed too high. Efforts to find alternative path ongoing.
Link to PROM Request and supporting documentation:
Equipment List:
