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Wet Bench CMOS Metal (wbclean3) (wbclean3)

New Normal Changes

About PPE: alcohol wipe down before and after each use. In addition, face shields will be placed in the steamer for 1 1/2 hours. Aprons will be user owned, not shared.

Overview

This part of the bench (right side) is the Wet Bench CMOS Metal (wbclean3).  It replaces some parts of the former wbmetal bench for processing of silicon wafers with standard metals, part of  the "semiclean" cleanliness group.  This station has one room temperature bath for peroxide solutions, one aluminum etch hot pot, two HF tanks for oxide etching, one contains 50:1 HF, and the second tank contains either 6:1 or 20:1 BOE, and one dump rinser. The SRD on the left side of this bench is used for both sides.

Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
25 wafers
Notes: 

Al, Ti, or W wet etching or oxide etching

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Contact the primary trainer: .

Operating Instructions