Wet Bench CMOS Metal (wbclean3) (wbclean3)
This part of the bench (right side) is the Wet Bench CMOS Metal (wbclean3). It replaces some parts of the former wbmetal bench for processing of silicon wafers with standard metals, part of the "semiclean" cleanliness group. This station has one room temperature bath for peroxide solutions, one aluminum etch hot pot, two HF tanks for oxide etching, one contains 50:1 HF, and the second tank contains either 6:1 or 20:1 BOE, and one dump rinser. The SRD on the left side of this bench is used for both sides.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Al, Ti, or W wet etching or oxide etching
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists
. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form
on clean room paper.