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ThermcoPoly2 (thermcopoly2)

Overview

The third furnace from the top in Thermco bank2 is the ThermcoPoly2 Furnace.

SNF staff

Same as ThermcoPoly1 but in the "flexible (gold-contaminated)" group.   Materials can be processed in this furnace, as long as they do not contain materials with high vapor pressure at deposition temperatures (such as zinc or many II-VI or III-V compounds.) Contact SNF PromCommittee for questions about specific materials.

Cleanliness: 
Flexible

Processing Technique(s)

Capabilities and Specifications

Cleaning Required: 
Pre-Diffusion Clean
Material Thickness Range: 100.0 Å - 3.0 μm
Process Temperature Range: 
525 °C - 650 °C
Maximum Load: 
44
Notes: 

Standard polysilicon deposition at 620C. P and N doping available.

Lab Organization, Location, and Badger Information

Lab Organization: 
Stanford Nanofabrication Facility Cleanroom (SNF Cleanroom)
Location: 
SNF Cleanroom Paul G Allen L107
Badger Area: 
SNF: Chemical Vapor Deposition
Badger ID: 
thermcopoly2

Training and Maintenance

Lab Facility: 
SNF Cleanroom
Training Charges: 
3.00 hours
Primary Trainer: 
Maurice Stevens
Primary Maintenance: 
Saeed Nejad

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Contact the primary trainer:
    .

Operating Instructions

ThermcoPoly2
Equipment name & Badger ID Cleanliness Cleaning Required Gases Substrate Size Process Temperature Range Maximum Load (number of wafers) Notes
Epi2
epi2 		Clean Pre-Diffusion Clean
600 °C - 1200 °C
1

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
ThermcoLTO
thermcoLTO 		Flexible
300 °C - 450 °C
26

limits on material vapor pressure
ThermcoPoly1
thermcopoly1 		Clean Pre-Diffusion Clean
525 °C - 650 °C
44

Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.
ThermcoPoly2
thermcopoly2 		Flexible Pre-Diffusion Clean
525 °C - 650 °C
44

Standard polysilicon deposition at 620C. P and N doping available.
TylanBPSG
tylanbpsg 		Clean, Semiclean Pre-Diffusion Clean, Standard Metal Clean
300 °C - 450 °C
26