The third furnace from the top in Thermco bank2 is the ThermcoPoly2 Furnace.
Same as ThermcoPoly1 but in the "flexible (gold-contaminated)" group. Materials can be processed in this furnace, as long as they do not contain materials with high vapor pressure at deposition temperatures (such as zinc or many II-VI or III-V compounds.) Contact SNF PromCommittee for questions about specific materials.
Standard polysilicon deposition at 620C. P and N doping available.
Equipment name & Badger ID | Cleanliness | Cleaning Required | Gases | Substrate Size | Process Temperature Range | Maximum Load (number of wafers) | Notes |
---|---|---|---|---|---|---|---|
Epi2 epi2 |
Clean | Pre-Diffusion Clean |
600 °C - 1200 °C
|
1 |
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr |
||
ThermcoLTO thermcoLTO |
Flexible |
300 °C - 450 °C
|
26 |
limits on material vapor pressure |
|||
ThermcoPoly1 thermcopoly1 |
Clean | Pre-Diffusion Clean |
525 °C - 650 °C
|
44 |
Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available. |
||
ThermcoPoly2 thermcopoly2 |
Flexible | Pre-Diffusion Clean |
525 °C - 650 °C
|
44 |
Standard polysilicon deposition at 620C. P and N doping available. |
||
TylanBPSG tylanbpsg |
Clean, Semiclean | Pre-Diffusion Clean, Standard Metal Clean |
300 °C - 450 °C
|
26 |