Thermco Bank one containing ThermcoPoly.
Polycrystalline silicon (also called "poly-Si" or "poly") is deposited at a low pressure (~500 mtorr) using silane (SiH4). The tube has a sloping temperature profile. Deposition temperature is ~620C for polysilicon and ~520C for amorphous silicon. This furnace can handle wafers up to 6 inch and is plumbed with Ge, PH3 and B2H6.
Capabilities and Specifications
Material Thickness Range: 100.0 Å - 3.0 μm
Process Temperature Range:
Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.
Lab Organization, Location, and Badger Information
SNF: Chemical Vapor Deposition
Training and Maintenance
Steps to become a tool user
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF