ThermcoNitride (thermconitride1)
Overview
Thermco Bank one containing ThermcoNitride.
SNF staff
Silicon nitride (or nitride or Si3N4) is deposited at moderately high temperatures (~800C) and low pressure (~250 mtorr), using dichlorosilane (SiCl2H2) and ammonia (NH3). This furnace handles wafer up to 6 inch.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Cleaning Required:
Lab Supplied Materials
Material Thickness Range: 100.0 Å - 2.0 μm
Process Temperature Range:
785 °C - 850 °C
Gases
Substrate Type
Substrate Sizes
Maximum Load:
44
Notes:
Stociometric and low stress (~150mPa) programs available
Lab Organization, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
SNF: Chemical Vapor Deposition
Badger ID:
thermconitride1
Training and Maintenance
Lab Facility:
Training Charges:
3.00 hours
Primary Trainer:
Primary Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form on clean room paper. - Contact the primary trainer: .
Printer-friendly version