Thermco Bank one containing ThermcoNitride.
Silicon nitride (or nitride or Si3N4) is deposited at moderately high temperatures (~800C) and low pressure (~250 mtorr), using dichlorosilane (SiCl2H2) and ammonia (NH3). This furnace handles wafer up to 6 inch.
Capabilities and Specifications
Material Thickness Range: 100.0 Å - 2.0 μm
Process Temperature Range:
Stociometric and low stress (~150mPa) programs available
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists
. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form
on clean room paper.