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STS Deep RIE Etcher (stsetch)


photo of stsetch in SNF Cleanroom

This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.


Capabilities and Specifications

Maximum Load: 

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching

Lab Organization, Location, and Badger Information

Badger Area: 
SNF: Dry Etching
Badger ID: 

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Study the relevant operating procedures:
  2. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  3. Contact the primary trainer: Lavendra Mandyam

Operating Instructions