STS Deep RIE Etcher (stsetch)
This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check the training calendar to for any scheduled training:
Read the relevant operating procedures before the training session:
Optional: For background on "Plasma Etching" and "Choosing an Etcher", Online training required. Open Online Course
for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login
to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" Section for the three videos on plasma etching principles and go to the "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Attend the training session to be qualified.