Exposure

For photolithography processing SNF houses three types of UV exposure tools: contact aligner, direct write (mask-less) system, and a stepper. All of these systems utilize near-UV sensitive photoresist for pattern transfer. Selection of the appropriate exposure tool depends upon the specifics of the project. Listed in each tool’s webpage specific capabilities such as resolution, alignment, and substrate handling capability are discussed.

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Stepper	ASML PAS 5500/60 i-line Stepper asml	ASML PAS 5500/60 i-line stepper, automatic for 25 inch wafers, 450nm resolution, 365nm near-UV light	All	SNF Cleanroom Paul G Allen L107
Contact Aligner	EVG Contact Aligner evalign	1:1 Contact Mask Aligner, 1.5 um resolution, single wafer, manual system	All	SNF Cleanroom Paul G Allen L107
Direct Write	Heidelberg MLA 150 heidelberg	Maskless writer that patterns without prior fabrication of masks.	All	SNF Exfab Paul G Allen 104 Stinson
Direct Write	Heidelberg MLA 150 - 2 heidelberg2	Maskless writer that patterns without prior fabrication of masks.	All	SNF Cleanroom Paul G Allen L107
Contact Aligner	Karl Suss MA-6 Contact Aligner karlsuss	Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR).	All	SNF Cleanroom Paul G Allen L107
Contact Aligner	Karl Suss MA-6 Contact Aligner karlsuss2	Karl Suss MA-6 Mask Aligner is a 1:1 Contact Aligner, 1.5 um resolution, single wafer, manual system (Backside align, including IR).	All	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Minimum Resolution	Exposure Wavelength	Substrate Size	Maximum Load (number of wafers)	Mask Size	Notes
Stepper	ASML PAS 5500/60 i-line Stepper asml	All	0.45 μm	365 nm	4"		5 inch	5:1 reducing stepper
Contact Aligner	EVG Contact Aligner evalign	All	1.50 μm	350 - 450 nm	Pieces 2" 3" 4" 6"	one piece or wafer	5 inch, 7 inch	1:1 Contact Aligner. Anodic Bond, backside align, including IR.
Direct Write	Heidelberg MLA 150 heidelberg	All	1.00 μm	405 nm	Pieces 2" 3" 4" 6"	1		Direct Write
Direct Write	Heidelberg MLA 150 - 2 heidelberg2	All	0.60 μm	375 nm	Pieces 2" 3" 4" 6"	1		Direct Write
Contact Aligner	Karl Suss MA-6 Contact Aligner karlsuss	All	1.50 μm	365 nm	Pieces 2" 3" 4" 6"		4 inch, 5 inch, 7 inch	1:1 Contact Aligner. Backside align, including IR.
Contact Aligner	Karl Suss MA-6 Contact Aligner karlsuss2	All	1.50 μm	365 nm or 405 nm	Pieces 2" 3" 4" 6"		4 inch, 5 inch, 7 inch	1:1 Contact Aligner. Backside align.