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Deposition

Deposition covers a wide variety of methods that are used to add a wide variety of materials. The subcategories here can be useful to help narrow down your search.

  • Atomic Layer Deposition (ALD) is used to deposit less than 50nm of highly conformal films.
  • Chemical Vapor Deposition (CVD) is used to deposit films less than 5μm thick, carbon nanotubes, and graphene.
  • Deposited III-N uses a type of CVD called MOCVD to deposit the nitrides of materials that are found in group III of the periodic table.
  • Deposited III-V uses a type of CVD called MOCVD to deposit combinations of materials from group III and group V of the periodic table.
  • Ink lists the equipment that can be used to print inks that are either commercially available or made by the user.
  • Physical Vapor Deposition (PVD) is used to deposit primarily metal layers as well as some dielectrics.
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Equipment name & Badger ID Locationsort descending Image Overview Materials Lab Supplied Link to Training
Fiji 2
fiji2
SNF Cleanroom Paul G Allen L107
photo of Fiji2 in SNF Cleanroom

Fiji2 is a load-locked, plasma-enabled atomic layer deposition (ALD) system....

Fiji 1 and 2 Training
Fiji 3
fiji3
SNF Cleanroom Paul G Allen L107
photo of Fiji3 in SNF Cleanroom

The Fiji3 ALD system from Cambridge Nanotech/Ultratech is a plasma...

Fiji 3 Training
Innotec Evaporator
Innotec
SNF Cleanroom Paul G Allen L107

Innotec is an E-beam metal evaporation system, capable of depositing...

Innotec Evaporator Training
MVD
mvd
SNF Cleanroom Paul G Allen L107

MVD is a molecular vapor deposition (MVD) system. It is...

MVD Training
Intlvac Evaporation
Intlvac_evap
SNF Cleanroom Paul G Allen L107
Intlvac Evaporation Training
Savannah
savannah
SNF Cleanroom Paul G Allen L107
photo of Savannah in SNF cleanroom

Savannah is a thermal atomic layer deposition (ALD) system. It...

Savannah Training
Epi2
epi2
SNF Cleanroom Paul G Allen L107
Applied Materials Centura Epi2  tool in SNF

Epi2 is the the first chamber on the tool and...

AMAT Centurion Epitaxial Training
STS Plasma Enhanced CVD
sts
SNF Cleanroom Paul G Allen L107
STS Plasma Enhanced CVD Training
Lesker2 Sputter
lesker2-sputter
SNF Cleanroom Paul G Allen L107
Lesker2-Sputter

Lesker2 is a load locked single wafer metal sputter providing...

Lesker2 Sputter Training
PlasmaTherm Shuttlelock PECVD System
ccp-dep
SNF Cleanroom Paul G Allen L107
PlasmaTherm Shuttlelock PECVD System Training
AJA2 Evaporator
aja2-evap
SNF Cleanroom Paul G Allen L107

The AJA e-beam evaporator can be used to directionally deposit...

AJA2 Evaporator
ThermcoLTO
thermcoLTO
SNF Cleanroom Paul G Allen L107

Silicon dioxide (SiO2) is deposited at between 300 and 450C...

Thermco LTO Deposition Furnace Training
Fiji 1
fiji1
SNF Cleanroom Paul G Allen L107
photo of Fiji1 in SNF Cleanroom

Fiji1 is a load-locked, plasma-enabled atomic layer deposition (ALD) system....

Fiji 1 and 2 Training
Teos2
teos2
SNF Cleanroom Paul G Allen L107

Teos2 furnace allows LPCVD deposition of silicon dioxide, using tetraethyl...

Teos Deposition Furnace Training
ThermcoNitride
thermconitride1
SNF Cleanroom Paul G Allen L107

Silicon nitride (or nitride or Si3N4) is deposited at moderately...

Thermco Nitride Deposition Furnace Training
TylanBPSG
tylanbpsg
SNF Cleanroom Paul G Allen L107

Silicon dioxide (SiO2) is deposited at between 300 and 450C...

TylanBPSG Deposition Furnace Training
ThermcoPoly1
thermcopoly1
SNF Cleanroom Paul G Allen L107

Polycrystalline silicon (also called "poly-Si" or "poly") is deposited at...

Thermco Poly Deposition Furnace Training
ThermcoPoly2
thermcopoly2
SNF Cleanroom Paul G Allen L107

Same as ThermcoPoly1 but in the "flexible (gold-contaminated)" group.  ...

Thermco Poly Deposition Furnace Training
PlasmaTherm Versaline HDP CVD System
hdpcvd
SNF Cleanroom Paul G Allen L107
PlasmaTherm Versaline HDP CVD System Training
Voltera
voltera
SNF Exfab Paul G Allen 151 Ocean
Voltera Training

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