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Physical Vapor Deposition (PVD)

PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Technique Tabs

Main Tab

Processing Techniques	Equipment name & Badger ID	Teaser Blurb	Cleanliness	Location
Evaporation	Innotec Evaporator Innotec		Flexible	SNF Cleanroom Paul G Allen L107
Sputtering	Hummer V Sputter Coater hummer		Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Evaporation	Intlvac Evaporator Intlvac_evap		Clean, Semiclean	SNF Cleanroom Paul G Allen L107
Evaporation	AJA Evaporator aja-evap		Flexible	SNF Exfab Paul G Allen 155A Venice
Sputtering	Lesker2 Sputter lesker2-sputter		Semiclean	SNF Cleanroom Paul G Allen L107
Sputtering	Lesker Sputter lesker-sputter		Flexible	SNF Exfab Paul G Allen 155A Venice
Evaporation	AJA2 Evaporator aja2-evap	This E-beam evaporator can evaporate a variety of semi-clean materials onto your substrates. It is equipped with an ion gun for precleaning samples.	Semiclean	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & Badger ID	Cleanliness	Materials Lab Supplied	Material Thickness Range	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Gases	Notes
Evaporation	Innotec Evaporator Innotec	Flexible	Ag Al Au Co Cr Cu Fe Ge In Ni Pd Si Ta Ti W Moly		Pieces 2" 3" 4" 6"	22 four inch wafers			Precious metals limit is <200nm
Sputtering	Hummer V Sputter Coater hummer	Flexible
Evaporation	Intlvac Evaporator Intlvac_evap	Clean, Semiclean	Al Co Cr Ge Hf Nb Ni Pd Si Ta Ti V W Zr Moly	0.00 - 0.50 μm	Pieces 2" 3" 4" 6"	12 4 inch wafers, 2 6 inch wafers
Evaporation	AJA Evaporator aja-evap	Flexible	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania	0.00 - 300.00 nm	Pieces 2" 3" 4" 6"	4"x3 or 6"x1 wafers or pieces			For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Sputtering	Lesker2 Sputter lesker2-sputter	Semiclean	Ag Al AlSi Cr Ge Pd Ru Sc Si SiO₂ Sn Ta Ti TiN W Alumina ITO Moly	1.00 μm	Pieces 2" 3" 4" 6"	one 4 inch wafer, one 6 inch wafer	°C - 800 °C	Ar N₂ O₂	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Sputtering	Lesker Sputter lesker-sputter	Flexible	Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO		Pieces 2" 3" 4" 6"	1 4 inch wafer, 1 6 inch wafer			reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Evaporation	AJA2 Evaporator aja2-evap	Semiclean	Ag Al Co Cr Ge Hf Nb Pd Pt Si Ta Ti V W Zr Moly	0.00 - 300.00 nm	Pieces 2" 3" 4" 6"	4"x3 or 6"x1 wafers or pieces			For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance