Decontamination

Decontamination cleans are used to remove trace metals and particles from substrates. This step is required for post processing of wafers and pieces that have gone through KOH-etching, chemical-mechanical polishing (cmp), and the wafer saw. For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page.

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Decontamination	Wet Bench Decontamination wbdecon	Decontamination of 3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group.	Clean	SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching	Wet Bench Flexcorr 1 wbflexcorr-1	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Chemicals	Primary Materials Etched	Other Materials Etched	Substrate Size	Notes
Decontamination	Wet Bench Decontamination wbdecon	Clean	SC2			3" 4" 6"	KOH or wafersaw or post-cmp decontamination
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching	Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	Acids Bases Gold Etchant H₃PO₄ 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W	Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Techniques

Decontamination

Technique Tabs