PlasmaTherm Versaline HDP CVD System (hdpcvd)
Capabilities and Specifications
Material Thickness Range: 500.0 Å - 4.0 μm
Process Temperature Range:
To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
We do not have a staff member assigned to training on it at this time. What we suggest is that labmembers wanting training on the tool contact a trained research group co-worker or other trained labmember for training and/or shadowing. Once the 'trainee' is comfortable in the use of the tool they contact the responsible Process Staff member for badger qualification. This is done with the understanding that the newly trained labmember may be approached for training eventually.If you cannot find someone to train you after looking at history in badger please contact the responsible Process Staff member and a trainer will be identified.The labmember is responsible for having read and understood any and all documentation related to the tool. A Training Check List is included in these Operating Instructions. It can be a good tool to make sure everything has been covered in the shadowing session.Please print and fill out this Shadowing Form
. After the session give the form to the responsible staff member for qualification.
Check the training calendar for any scheduled training:
Read the relevant operating procedures:
Attend the training session and get qualified.