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Oxford PlasmaPro 80 - Reactive Ion etcher (RIE: Oxford PlasmaPro 80 (at SNSF))

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 

No carrier wafer needed; multiple pieces can be processed together Location: SNSF; Spilker Building - Nanopatterning cleanroom

Lab Facility, Location, and Badger Information

Badger ID: 
RIE: Oxford PlasmaPro 80 (at SNSF)

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours

Steps to become a tool user

  1. Become a member of SNSF.
  1. Read the relevant operating procedures:
  2. Contact the primary trainer,
    , to schedule/ sign-up for the scheduled training.
  3. Attend the training and get qualified.

Operating Instructions