Oxford PlasmaPro 80 - Reactive Ion etcher (RIE: Oxford PlasmaPro 80 (at SNSF))
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
No carrier wafer needed; multiple pieces can be processed together Location: SNSF; Spilker Building - Nanopatterning cleanroom
Lab Facility, Location, and Badger Information
RIE: Oxford PlasmaPro 80 (at SNSF)
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Online training optional. For background on plasma etching refer to videos and steps to choose an etcher, refer to the Lagunita site. See Open Online Course
for general information about the Lagunita online training.
Go to Online Nano Course Login
to log in directly to the course. Go to the Dry Etching Section under nano@stanford for the three videos on plasma etching principles and go to the "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Attend the training and get qualified.