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Metalica Sputter (metalica)


photo of metalica

Metalica is a metal sputter that was built “in-house” to provide flexible processing options for non-CMOS compatible materials. Two magnetron S-guns provide the high energy source for sputtering of the metal target. Metalica is classified as gold contaminated and provides non-directional thin film (< 1 um) deposition of Ti, Cu, Au, Al, Ag, Cr, Mo, Pd, Pt, W and NiCr.


Capabilities and Specifications

Material Thickness Range: 0.0 - 1.0 μm
Process Temperature Range: 
Maximum Load: 
4 4 inch wafers

Precious metals limit is <200nm

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
3.00 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Contact the primary trainer: for training schedule.

with two shadowing sessions before training

Operating Instructions