We have a KJ Lesker e-gun/beam evaporator available in the Nanopatterning Cleanroom (Spilker 006). Key features: Load-lock for cleanliness and faster pump down times (5-10 minutes per wafer) Up to a single 6 inch wafer can be inserted into the deposition chamber. Smaller pieces and wafer fragments can also be mounted on the water cooled substrate puck. An Ar ion source for cleaning the substrate immediately prior to metal deposition. A substrate to e-gun source distance of 24 inches which reduces side wall accumulation for better liftoff results. The substrate holder has tilt control which permits depositing materials at angles other than 90 degrees. We allow gold (Au) in the chamber. We allow wafers with patterned photo resists for lift-off processes. We are currently avoiding evaporating magnetic metals (Fe and Co) for the sake of users working with superconductors. It has 8 pockets for different materials. We currently have it stocked with: Ag, Al, Au, Cr, Cu, Ge, Ni, Pd, Pt, and Ti. We will consider introducing additional materials based on user demand. Please note that certain precious metals will be charged separately from the hourly usage of the instrument.
Spilker Engineering: SNSF membership required