Drytek 100 Plasma Etcher (drytek2)
The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. Drytek4 (contaminated) also has additional capabilities for oxide etching and argon sputter etching.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check the training calendar for any scheduled training:
Read the relevant operating procedures:
Online training optonal. See Open Online Course
for general information about the Lagunita online training.
Go to Online Nano Course Login
to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
You can also shadow and experienced user and submit the completed shadowing form to get qualified.
Get qualified by either attending the training or submitting the shadowing form.