Skip to content Skip to navigation

Drytek 100 Plasma Etcher (drytek2)


photo of drytek2 etcher in SNF cleanroom

The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. Drytek4 (contaminated) also has additional capabilities for oxide etching and argon sputter etching.


Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 

Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode

Lab Facility, Location, and Badger Information

Training and Maintenance

photo of drytek2 etcher in SNF cleanroom
Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check the training calendar for any scheduled training: .
  2. Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
  3. Read the relevant operating procedures:
  4. Get qualified by either attending the training or submitting the shadowing form.