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Drytek 100 Plasma Etcher (drytek2)

Overview

photo of drytek2 etcher in SNF cleanroom

The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. Drytek4 (contaminated) also has additional capabilities for oxide etching and argon sputter etching.

Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
6
Notes: 

Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode

Lab Facility, Location, and Badger Information

Training and Maintenance

photo of drytek2 etcher in SNF cleanroom
Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check the training calendar for any scheduled training: .
  2. Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
  3. Read the relevant operating procedures:
  4. Get qualified by either attending the training or submitting the shadowing form.