Skip to content Skip to navigation

DISCO Wafer Saw (DISCO wafersaw)


Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.  


Processing Technique(s)

Capabilities and Specifications

Material Thickness Range: μm mm
Process Temperature Range: 
Maximum Load: 
1x4", 1x6" or 1x8" wafer, or pieces

Lab Facility, Location, and Badger Information

Lab Organization: 
Badger Area: 
Badger ID: 
DISCO wafersaw

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Contact the primary trainer: for training schedule.

Operating Instructions