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DISCO Wafer Saw (DISCO wafersaw)

Overview

Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.  

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Material Thickness Range: μm mm
Process Temperature Range: 
Maximum Load: 
1x4", 1x6" or 1x8" wafer, or pieces

Lab Facility, Location, and Badger Information

Lab Organization: 
Badger Area: 
Badger ID: 
DISCO wafersaw

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the operating procedures including procedure for blade changes:
  2. Contact the primary trainer: for training schedule.
  3. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user.We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You must shadow a qualified user at least twice to be comfortable with the tool.
    Follow the instructions on this form: SNF Training Shadowing Form

Operating Instructions