DISCO Wafer Saw (DISCO wafersaw)
Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.
Capabilities and Specifications
Material Thickness Range: μm mm
Process Temperature Range:
1x4", 1x6" or 1x8" wafer, or pieces
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the operating procedures including procedure for blade changes:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user.We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You must shadow a qualified user at least twice to be comfortable with the tool.
Follow the instructions on this form: SNF Training Shadowing Form