SNF is open under New Normal Rules. ANY shadowing must be coordinated with SNF staff first.
DISCO Wafer Saw (DISCO wafersaw)
Overview
Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.
Cleanliness:
Capabilities and Specifications
Material Thickness Range: μm mm
Process Temperature Range:
Substrate Type
Substrate Sizes
Maximum Load:
1x4", 1x6" or 1x8" wafer, or pieces
Lab Facility, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
Badger ID:
DISCO wafersaw
Training and Maintenance
Lab Facility:
Training Charges:
2.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Contact the primary trainer: for training schedule.
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