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Stanford Nanofabrication Facility
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. ANY shadowing must be coordinated with SNF staff first.
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Equipment
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Operating Instructions
DISCO wafersaw
DISCO Wafer Saw (DISCO wafersaw)
Overview
Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.
Cleanliness:
Flexible
Processing Technique(s)
Machining
>
Wafer Saw
Capabilities and Specifications
Material Thickness Range:
μm
mm
Process Temperature Range:
Substrate Type
Silicon
Quartz
Sapphire
Glass
Germanium
Silicon Carbide
Gallium Nitride
III-V
Gallium Arsenide
Substrate Sizes
Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
8 inch wafer
Maximum Load:
1x4", 1x6" or 1x8" wafer, or pieces
Lab Facility, Location, and Badger Information
Lab Organization:
(SNF Exfab)
Location:
SNF Exfab Paul G Allen 159 Capitola
Badger Area:
nSiL: 155A Venice
Badger ID:
DISCO wafersaw
Training and Maintenance
Lab Facility:
SNF Exfab
Training Charges:
2.00 hours
Primary Trainer:
Swaroop Kommera
Primary Maintenance:
Elmer Enriquez
Backup Maintenance:
Gary Sosa
Steps to become a tool user
Become a
member of SNF
.
Read the relevant operating procedures:
DISCO wafersaw
Contact the primary trainer:
Swaroop Kommera
for training schedule.
Operating Instructions
DISCO wafersaw
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