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LPCVD Equipment Summary

This is a summary of the Low Pressure Chemical Vapor Deposition (LPCVD) equipment.

LPCVD Equipment Summary

Processing Technique Cleanliness Gases Cleaning Required Substrate Size Maximum Load Process Temperature Range Material Thickness Range Notes
EPI (CVD), Low Pressure (LP) CVD, Hydrogen (H2) Annealing, Doping, Plasma Enhanced (PE) CVD AMAT Centurion Epitaxial System (epi2) Clean Pre-Diffusion Clean
1
600 °C - 1200 °C
50.00 Å - 3.00 μm

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

Last modified: 30 Jan 2023