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Acids

Acids are used typically to etch or clean substrates.

List of Acids

20:1 Buffered oxide etch aka "20:1 BOE" (38% NH4F, 2% HF, 60% H2O)
50:1 Hydrofluoric Acid aka "50:1 HF" (50:1 HF)
6:1 Buffered oxide etch aka "6:1 BOE" (34% NH4F, 7% HF, 59% H2O)
9:1 Piranha Solution aka "9:1 Piranha" (9:1 H2SO4:H2O2)
Standard Clean 1 aka "SC1" (5:1:1 H2O:H2O2:NH4OH)
Standard Clean 2 aka "SC2" (H2O:H2O2:HCl (5:1:1))
Partial words okay.
Equipment name & Badger ID Training Required & Charges Cleanliness Locationsort descending Chemicals Notes
Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training
2.25 hours
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training
2.25 hours
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training
2.25 hours
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training
2.25 hours
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.

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