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Function and Method(s):
Photolithography
Inductively Coupled Plasma Etching (ICP)
Equipment Used:
Aixtron MOCVD - III-V system (aix200)
ASML PAS 5500/60 i-line Stepper (asml)
Oxford III-V etcher (Ox-35)
Vertical Semiconductor Blades- Final Report
Vertical Semiconductor Blades- Final Report
PDF File:
Vertical Semiconductor Blades- Final Report
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Materials
III-V materials (III-V materials)
Indium Antimonide (InSb)
Thursday, August 10, 2023
