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Function and Method(s):
Bonding
Equipment Used:
Finetech Lambda (flipchipbonder)
Plasma activated direct bonding of silicon and lithium niobate thin films
Plasma activated direct bonding of silicon and lithium niobate thin films
PDF File:
Plasma activated direct bonding of silicon and lithium niobate thin films
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Materials
Lithium Niobate (LiNb)
Silicon (Si)
Thursday, August 10, 2023
