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Function and Method(s):
Reactive Ion Etching (RIE)
Equipment Used:
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Presentation
Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Presentation
PDF File:
Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Presentation
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Thursday, August 10, 2023
