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Function and Method(s):
Bonding
Equipment Used:
Finetech Lambda (flipchipbonder)
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation
PDF File:
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation
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Thursday, August 10, 2023
