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Function and Method(s):
Reactive Ion Etching (RIE)
Equipment Used:
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Development of Fluorine Plasma Treatment for AlGaN/GaN Device Isolation- Final Presentation
Development of Fluorine Plasma Treatment for AlGaN/GaN Device Isolation- Final Presentation
PDF File:
Development of Fluorine Plasma Treatment for AlGaN/GaN Device Isolation- Final Presentation
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Thursday, August 10, 2023
