Skip to content
Skip to navigation
SUNetID Login
SUNetID Login
Stanford Nanofabrication Facility
Navigation menu
Guide Main Menu
SNF Home
Guide Home
Techniques
Overview
Processing Techniques
Projects
Nano Nuggets
Processes
Runsheets
Safety & Policies
Overview
Lab Manual
1.0 General Policies
2.0 Getting Around
3.0 Safety for All
4.0 General Chemical Safety
5.0 Appendices
Safety Training
SDS
Mavericks (ExFab Room 155) Policies
Prescription Safety Glasses
Training
Overview
Training Calendar
Training Course Online
Training Shadowing Form
Training Videos
All Litho class
Materials
Overview
Chemicals & Materials
Cleanliness Groups
New Process or Material Requests (PROM)
Chemicals List
Materials List
Gases List
Useful Links
Wafer Dopant and Resistivity Specs
Lab Management System (Badger)
Events
Discussion Lists
External Links
Face shield cleaning using steamer
People
Staff List
For Emergencies
Technical Liaisons
Consultants
Equipment
Equipment Name Table
Characterization Equipment
CVD Equipment
Doping Equipment
Dry Etch Equipment
Metallization Equipment
Oxidation and Annealing Equipment
Photolithography Equipment
Wet Bench Equipment
Related Links
Function and Method(s):
Bonding
Equipment Used:
Finetech Lambda (flipchipbonder)
SOP for plasma activated direct bonding with the Flipchip tool
SOP for plasma activated direct bonding with the Flipchip tool
PDF File:
SOP for plasma activated direct bonding with the Flipchip tool
This should be displaying the file at https://snfexfab.stanford.edu/sites/snfexfab/files/sections/diplayfiles/e241_sop_plasma_activated_bonding_flipchip_sd_bo.pdf inline. If it's not, look to see if your browser is set to automatically download pdf filess
Thursday, July 8, 2021
