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Finetech Lambda Flipchip Bonder and Process Integration New User Tips

Image of bonder and chip
The purpose of this document is to provide “tips” or “tricks” from a perspective of someone who has minimum to zero micro/nanofabrication experience prior to taking the class E241, with the hope that new SNF lab members will find some information useful for conducting the experiments efficiently.  These tips are focused on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding.

Finetech Lambda Flipchip Bonder and Process Integration New User Tips

Materials
Wednesday, April 14, 2021